Product Type:Input Module
Module Family:RX3i
Power Supply:120VAC
Isolation:Yes
Points:16
Communication Protocol:RS-485
Dimensions:85mm x 64mm x 56mm
Weight:125g
Operating Temperature:-10°C to +60°C
Storage Temperature:-40°C to +85°C
Engineered for seamless integration into GE’s PACSystems RX3i platforms, the IC694MDL250 excels in providing reliable and efficient signal processing for demanding industrial applications.
Each of its 16 channels is meticulously isolated to minimize interference and ensure the integrity of data transmission, even under harsh industrial conditions.
Supporting a wide range of communication protocols, this module enables seamless connectivity with various devices and systems, enhancing operational efficiency.
Crafted from high-grade materials, it withstands the rigors of industrial environments, ensuring longevity and robust performance over extended periods.
User-friendly installation and configuration, thanks to GE Fanuc’s comprehensive software suite, makes it accessible to both experienced technicians and new users alike.
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