Process Compatibility:Versatile for multiple semiconductor fabrication processes
Power Consumption:2.5 kW @ 400V AC
Cooling System:Water-cooled with automatic temperature control
Dimension:300mm x 300mm x 150mm
Weight:20kg
Operating Temperature:-10°C to 50°C
Storage Temperature:-20°C to 60°C
The ASML SVG 99-80266-01 boasts an advanced design that ensures precise and reliable wafer manipulation during critical semiconductor fabrication steps. With its superior accuracy of ±0.01mm, it significantly reduces yield loss and enhances overall process throughput.
Equipped with robust aluminum alloy construction and ceramic bearings, this module is built to withstand the harsh conditions of high-volume manufacturing environments, ensuring long-term reliability and maintenance-free operation.
Featuring a high-speed performance capable of up to 1000 mm/s, the ASML SVG 99-80266-01 accelerates the production cycle without compromising on the quality of wafer alignment, making it indispensable for optimizing the semiconductor manufacturing workflow.
Adaptable to a wide range of temperature conditions from -40°C to +125°C, this module ensures consistent performance across various processing stages, enhancing the versatility of its application in semiconductor facilities.
Designed with user convenience in mind, the ASML SVG 99-80266-01 includes a standard USB 3.0 interface, enabling seamless integration with existing automation systems and minimizing setup time, thus maximizing operational efficiency.
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